AuSn PASTE
Based on our accumulated know-how, we will put our company's extended development as our highest priority.
•Reflow and cleaning process with Gold-Tin Solder paste |
|
|---|
Reflow process
-
In case of using Hot plate
-
In case of using furnace
Cleaning flow of flux residue
Chip mount process
Applications
-
• Cap Sealing : SAW Filter, Quarts oscillator
-
Thermoelectric modules with Peltier devices
•Die bonding : RF (GaAs chips) and Optoelectronic (LED, PD,LD) devices
•Lead free : Alternatives of high Lead-Tin solder etc
Supplying Method
Comparison between AuSn paste and Ag epoxy resin paste
Comparison between AuSn paste and AuSn preform
-
Better wettability of molten solder compared to preform materials such as ribbons, pellets etc.
New Development
|
New Au-Sn solder paste for stamping method (Stamping paste is used 5um under Au-Sn particle) |
|---|
-
•Conventional paste
Pin : 1000um W-wire
-
•New paste for stamping
This paste shows better adhering ability to Pin.
-
-
This paste shows better stamping ability to substrate.
Product Line-up
| Sample name | Composition | M.P. | Particle size | Flux type | Viscosity of paste |
|---|---|---|---|---|---|
| Standard | Au80/Sn20 | 280℃ | 5-16um,<32um, 16-32um etc |
RMA Non-halogen |
Dispensing ⇒50-150Pa·s |
| High wet | Au78/Sn22 | Printing ⇒180-280Pa·s |
New paste for stamping
| Sample name | Composition | M.P. | Particle size | Flux type | Viscosity of paste |
|---|---|---|---|---|---|
| Standard | Au80/Sn20 | 280℃ | < 5um | RA | Stamping ⇒30-50Pa·s |
| High wet | Au78/Sn22 |